The fully automatic gold-removal and tinning machine employs five-axis linkage combined with high-definition vision technology for precise control, enabling gold removal and tinning on the soldering surfaces of chips, oxide repair, and processing for both leaded and lead-free conversion, thereby enhancing solderability. It is widely applicable to gold removal and tinning of chips in high-reliability soldering fields, including QFP, QFN, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, S0, SOL, DL, PGA, and other packages. It effectively addresses gold brittleness, controls gold content, and prevents issues such as pin bridging and pin oxidation during manual tinning.