● Nozzle: Model: 505, 506, 507, 508 (choose nozzle according to different chips); Coaxiality: 0.05mm; Number of nozzles: 1; Suction weight: 5-200g
● Applicable chip types: QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, SO, SOL, DL, PGA, QFN and other IC packaging formats
● Applicable chip body size range: 5mm x 5mm to 50mm x 50mm
● Applicable pin pitch range: 0.4mm to 2.54mm
● Go to the tin furnace: tin surface fluctuation: ±0.2mm, controllable temperature 80-300°C
● Tin-coated pot: Tinned surface fluctuation: ±0.2mm, controllable temperature 80-300°C
● Flux coating unit: liquid level fluctuation: ±0.2mm, flux type: rosin water-based. Preheating unit: temperature control: ±5°C, controllable temperature range 80-180°C
● Visual unit: Pixels: 3 million, resolution accuracy: ±0.05mm
● Height measurement unit: Accuracy: ±0.2mm (solder surface height measurement accuracy), tilt angle 7.53°
● Phone clamping mechanism: Repeat accuracy of the mechanism: ±0.02mm Clamping weight: 5-200g
● Five-axis mechanism: repeatability of the mechanism: ±0.02mm, load: 1kg
● Power supply: AC200V to 240V, 50/60Hz
● Equipment dimensions: 1400x965x1550mm (excluding the tri-colour alarm light) (length x width x height)
● Humidity: 20%-80%, Temperature: 15°C-35°C
● Air source requirement: 0.55±0.1Mpa
● Exhaust requirement: one exhaust vent with an outer diameter of 101mm, air volume: 200 cubic metres per hour