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Tin coating machine

Product Introduction:

The fully automatic gold-removal and tinning machine employs five-axis linkage combined with high-definition vision technology for precise control, enabling gold removal and tinning on the soldering surfaces of chips, oxide repair, and processing for both leaded and lead-free conversion, thereby enhancing solderability. It is widely applicable to gold removal and tinning of chips in high-reliability soldering fields, including QFP, QFN, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, S0, SOL, DL, PGA, and other packages. It effectively addresses gold brittleness, controls gold content, and prevents issues such as pin bridging and pin oxidation during manual tinning.

Consultation Hotline: 86-20-3483 2401 3483 2402
Address: No. 20, Qunxing Street, Fuchong Village, Shawan Town, Panyu District, Guangzhou
Email: sales@zhonglichina.com

Application Fields

● Military: Aerospace, aviation, maritime and other areas requiring extremely high welding reliability.

● Civilian: High-quality chip welding.

Performance Characteristics

● Suitable for 0.4mm pin pitch or QFN flat type soldering ends

● Utilises X/Y/Z/U/W five-axis linkage combined with vision technology to achieve precise control

● Processed chips undergo high-definition camera quality inspection to detect defects such as solder bridges or solder residue on chip pins

● Adjustable suction for different components. The safety tweezers can easily handle irregular components and connectors, automatically aligning with the component centre and contour

● Process control: soldering temperature, soldering depth, movement speed, dwell time, soldering angle

● Solder pot low-solder alarm device

● Solder feeding low-solder material alarm

● Automatic solder fume purification function

● Automatic data recording for full traceability of the soldering process

● Open communication ports


Specifications

● Nozzle: Model: 505, 506, 507, 508 (choose nozzle according to different chips); Coaxiality: 0.05mm; Number of nozzles: 1; Suction weight: 5-200g

● Applicable chip types: QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, SO, SOL, DL, PGA, QFN and other IC packaging formats

● Applicable chip body size range: 5mm x 5mm to 50mm x 50mm

● Applicable pin pitch range: 0.4mm to 2.54mm

● Go to the tin furnace: tin surface fluctuation: ±0.2mm, controllable temperature 80-300°C

● Tin-coated pot: Tinned surface fluctuation: ±0.2mm, controllable temperature 80-300°C

● Flux coating unit: liquid level fluctuation: ±0.2mm, flux type: rosin water-based. Preheating unit: temperature control: ±5°C, controllable temperature range 80-180°C

● Visual unit: Pixels: 3 million, resolution accuracy: ±0.05mm

● Height measurement unit: Accuracy: ±0.2mm (solder surface height measurement accuracy), tilt angle 7.53°

● Phone clamping mechanism: Repeat accuracy of the mechanism: ±0.02mm Clamping weight: 5-200g

● Five-axis mechanism: repeatability of the mechanism: ±0.02mm, load: 1kg

● Power supply: AC200V to 240V, 50/60Hz

● Equipment dimensions: 1400x965x1550mm (excluding the tri-colour alarm light) (length x width x height)

● Humidity: 20%-80%, Temperature: 15°C-35°C

● Air source requirement: 0.55±0.1Mpa

● Exhaust requirement: one exhaust vent with an outer diameter of 101mm, air volume: 200 cubic metres per hour

Process flow diagram